In distinction thereto, it was confirmed that 10 Fit is assured for the current density exceeding 10.sup.6 A/cm.sup.2, within the ninth embodiment. In distinction thereto, the tactic by which the Al is stuffed into the groove of the interlayer insulator realizes that the stress is dispersed as described within the sixth and eighth embodiments Consequently, there's realized the electrode wiring construction by which the crystal grain boundaries do not occur in the bending portion or wiring connecting portion. Furthermore, by employing the electrode wiring construction in accordance with the current invention, there is obtained the one-crystal construction suppressing the stress, so that the reliability such because the resistance of migrations might be effectively improved. Though there has been described within the sixth embodiment the electrode structure the place the barrier metal is formed solely in the bottom face of the contact gap. FIG. 35 shows an electrode wiring construction in accordance with the eighth embodiment The electrode wiring construction proven in FIG. 34 is formed by the method where the Al is crammed into the groove of the interlayer insulator with annealing as described within the sixth in addition to seventh embodiments. These electrode wiring constructions are such that the Al is crammed into the groove of the interlayer insulator by annealing as described in the sixth and seventh embodiments.

The wiring having the uniform crystalline orientation has wonderful endurance against electromigration and stressmigration so as to improve the reliability of the electrode wiring. When the Al skinny film is agglomerated on the substrate having the above wiring grooves by means of annealing underneath a melting point thereof, Aluminum single wire the Al is filled into the groove while the Al is practically in melting state. Namely, the liquid contacts with the solid having a contact angle of .THETA. With reference to FIG. 39A and 39B, it's most well-liked that an angle A made by the bottom face and the aspect face of the groove or angles of bend B, C of the wiring are processed in a fashion that these angles are equal to the angles of crystal facet. Compared to a projection type structure which is etching-processed, in the groove kind construction the place the wiring metallic is crammed into the groove of the interlayer insulator, the wiring metallic is already lined with each the bottom face and side face of the groove, so that the stress generated at a later stage of thermal processing may be scattered into three faces and there does not stay the mechanical stress inside the wiring.

It rotates its legs when on it is facet to raise them horizontaly and then rotates them ahead. The Maxon motors had been too weak to elevate the robot sufficiently. I used to be originaly doing a 2 motor walker, but I realized the MECI motors couldn't elevate a walker, so I added 2 extra, one for each leg, however my mistake was that now it had almost 2x the burden and one motor remains to be all that lifts. The circuit board actualy becomes the body for the motors and the legs! This robotic is a very prime quality design, and it was kinda sad to remove and replace the motors, cause the bot was named for the motors supply (MECI). I just can't throw away a robotic I've spent almost 24 total hours on, even if I can save $forty on servos. Moreover, if the native oxide movie is suppressed from being formed on the wiring metal floor, the surface atoms shall be additional straightforward to maneuver, will tend to reach the melting state at a further lower temperature, and can forestall impurities akin to oxygen which disturbs the crystal orientation from mixing thereinto.

Next, with reference to FIG. 28D, there may be formed a SiO.sub.2 film 38 serving as the interlayer insulator, by a plasma CVD technique. On the floor of the SiO.sub.2 film 38, there is formed a groove 39 serving as a second layer Al wiring the place the width and depth thereof are 1.2 .mu.m and 0.Eight .mu.m, respectively, by the picture-lithography and RIE. With reference to FIG. 28E, the second layer Al wiring forty one was formed below the same condition wherein the primary layer Al wiring 37 was formed. When a plurality of grooves thus formed are usually not related in the identical layer, particularly, when the Al wirings are usually not related in the same layer as in pattern A, sample B and pattern C proven in FIG. 35, it was confirmed by the TEM analysis that every sample reveals different crystalline orientation. It is to be noted that the C movie used as the stopper layer may be removed with ease by subjecting it to the O.sub.2 plasma. Therefore, the atoms at the floor or grain boundary of the movie can be easily diffused with a small quantity of power. After the polishing was completed on the stopper layer, a small quantity of residual Al was removed by a wet etching.